During the International Solid State Circuits Conference (ISSCC), Intel has made room for some new projects that affect the future of communications equipment, business servers, memory and wireless transmission.
Intel has said several times: the future belongs to mobile Internet devices, multi-purpose devices that allow the user to browse, listen to music, chat. For these products, which require high computing power, but both have extremely low power consumption, Intel is developing its Silverthorne processor.
Layout Silverthorne CPU
carried out with the 45-nanometer production process High-K metal gate, the same as the Penryn CPU (desktop and mobile), this new processor is fully compatible with the instruction set of Core 2 processors Duo. The architecture, featuring a 16-stage pipeline "dual-issue in order" with Hyperthreading, non sarà solamente potente ma anche efficiente, grazie a nuove tecniche di risparmio energetico come lo stato Deep Power Down (C6), il controllo dinamico dei clock, l'ottimizzazione energetica dei file register e tanto altro. Silverthorne consumerà 10 volte in meno di un processore single-core Ultra Low Voltage Dothan. Intel punta a raggiungere un consumo massimo di 1-2 watt e frequenze non ancora decise, anche se l'obiettivo sembra essere quello dei 2 GHz.
Per quanto concerne il settore server, Intel ha pronto Tukwila: 2 miliardi di transistor, 30 Mbyte di cache on-die, processo produttivo a 65 nanometri. Intel punta molto sul nuovo processore della gamma Itanium. Tukwila non è solo un quad-core che gira a 2 GHz e integrates what we have just written, but boasts some new features as well as the new bus interconnection QuickPath, the dual-integrated memory controller and an advanced technology for the Protection of the existing process. Intel claims that this solution will double the performance compared to a dual-core Itanium 9100 and consume "only" 25% more.
With regard to the communication sector, Intel is developing 65-nanometer chip that can enable the reception of multiple radios, facilitating the connectivity of mobile products at any juncture. Here is the "vision" of Intel for the future:
Click to enlarge
all'ISSCC Finally we talked about memory Multi-Level Phase Change technology and Terascale. The MLC memory - according to Intel - they have all it takes to succeed with the current Flash. Developed by STMicroelectronics, the chips made from 256 Mbit to 90-nanometer process using a new programming algorithm that allows the creation of two additional states between the amorphous and crystalline.
Intel Terascale concluded talking about the technology that will allow the realization of high density memory, faster than DRAM and able to reach 128 GB / s at a frequency of 2 GHz with an access time of 2 nanoseconds.
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